Stiffener structure with beveled sidewall for footprint reduction and methods for forming the same

The chip package structure of claim 2, wherein the at least one tapered sidewall comprises:

• a second innermost tapered sidewall proximate to a second outermost sidewall of the fan-out package, wherein the second innermost tapered sidewall is tapered outward from the fan-out package in a direction towards the package substrate, and wherein the second innermost tapered sidewall is a distal sidewall from the first innermost tapered sidewall such that the fan-out package is positioned between the first innermost tapered sidewall and the second innermost tapered sidewall. The chip package structure of claim 4, wherein the at least one tapered sidewall comprises:
• a second outermost tapered sidewall proximate to the second innermost tapered sidewall, wherein the second outermost tapered sidewall is tapered inwards towards the fan-out package in the direction towards the package substrate.

A stiffener structure for attaching to a top surface of a package substrate, comprising:

• a first wall portion comprising a first sidewall including a top edge and a bottom edge, wherein the top edge of the first sidewall is a first horizontal distance away from the bottom edge of the first sidewall.