Semiconductor package and manufacturing method of semiconductor package

A semiconductor package, comprising:

• a substrate;
• an interconnect structure disposed over the substrate;
• a first die and a second die disposed over the interconnect structure in a side-by-side manner;
• a conductive layer at least covering at least a back surface of the first die or the second die and filling in a gap between the first die and the second die;
• and
• an encapsulating material laterally encapsulating the first die, a second die and the conductive layer.

A manufacturing method of a semiconductor package, comprising:

• providing an interconnect structure over a carrier;
• providing a plurality of dies over the interconnect structure in a side by side manner;
• providing a conductive layer over back surfaces of the adjacent two of the plurality of dies and filling an upper part of a gap;
• and
• providing an encapsulating material over the interconnect structure for encapsulating the plurality of dies and the conductive layer.