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US 2023/0402399 A1Published application
Semiconductor device and method for making the same
AssigneeSTATS ChipPAC Pte. Ltd.
InventorsSeungHyun LEE, KyungHwan KIM, HongKyu PARK, InHo SEO, MyungGyu JIN
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Abstract
A semiconductor device comprises a substrate, at least one electronic component mounted on the substrate, an encapsulant formed on the substrate and at least partially encapsulating the at least one electronic component, a shielding layer formed on the encapsulant, a thermal interface layer formed on the shielding layer, and a metal lid formed on the thermal interface layer.
Claims20
A semiconductor device, comprising:
- a substrate;
- at least one electronic component mounted on the substrate;
- an encapsulant formed on the substrate and at least partially encapsulating the at least one electronic component;
- a shielding layer formed on the encapsulant;
- a thermal interface layer formed on the shielding layer;
- and
- a metal lid formed on the thermal interface layer.
4 more elements
A semiconductor device, comprising:
- a substrate;
- at least one electronic component mounted on the substrate;
- an encapsulant formed on the substrate and at least partially encapsulating the at least one electronic component;
- a thermal interface layer formed on the encapsulant;
- a metal lid formed on the thermal interface layer;
- and
- a shielding layer formed on the substrate and covering the metal lid, the thermal interface layer and the encapsulant.
4 more elements
A method for making a semiconductor device, comprising:
- providing a substrate;
- mounting at least one electronic component on the substrate;
- forming an encapsulant on the substrate and at least partially encapsulating the at least one electronic component;
- forming a shielding layer on the encapsulant;
- forming a thermal interface layer on the shielding layer;
- and
- forming a metal lid on the thermal interface layer.
4 more elements
A method for making a semiconductor device, comprising:
- providing a substrate;
- mounting at least one electronic component on the substrate;
- forming an encapsulant on the substrate and at least partially encapsulating the at least one electronic component;
- forming a thermal interface layer on the encapsulant;
- forming a metal lid on the thermal interface layer;
- and
- forming a shielding layer on the substrate and covering the metal lid, the thermal interface layer and the encapsulant.
4 more elements
Dependencies are inferred from the claim text.