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US 2023/0402398 A1Published application
Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChe-Chi Wu, Chien-Tang Li
Life of this patent
Estimating the term…
Abstract
An electronic package is provided, in which a package module and a shielding member are disposed on a carrier structure, such that the shielding member covers a top surface and side surfaces of the package module to block the radiation outward from the package module and prevent problem that other electronic components on the carrier structure cannot be transmitted signals normally due to the electromagnetic interference of the package module.
Claims17
An electronic package, comprising:
- a carrier structure;
- a package module disposed on one side of the carrier structure, wherein the package module comprises a circuit structure electrically connected to the carrier structure, at least one electronic element disposed on and electrically connected to the circuit structure, and shielding bodies disposed on the circuit structure and surrounding the electronic element;
- a shielding member disposed on the carrier structure to cover the package module, wherein the shielding member comprises a metal sheet covering the electronic element and at least one shielding leg for supporting the metal sheet on the carrier structure, such that the shielding leg covers a side surface of the package module;
- and
- a heat dissipation member disposed on the carrier structure and connected to the shielding member.
2 more elements
A method of manufacturing an electronic package, comprising:
- providing a package module, wherein the package module comprises a circuit structure and at least one electronic element disposed on and electrically connected to the circuit structure;
- disposing the package module on one side of a carrier structure, wherein the circuit structure is electrically connected to the carrier structure;
- and
- disposing a shielding member on the carrier structure, wherein the shielding member covers the package module, and wherein the shielding element comprises a metal sheet covering the electronic element and at least one shielding leg for supporting the metal sheet on the carrier structure, such that the shielding leg covers a side surface of the package module.
1 more element
Dependencies are inferred from the claim text.