Semiconductor device including dielectrics made of porous organic frameworks, and method of fabricating the same

A semiconductor device, comprising:

• a substrate;
• an interconnection layer disposed on the substrate, wherein the interconnection layer comprises:
• a first covalent organic framework (COF) layer disposed on the substrate;
• a first conductive layer surrounded by the first COF layer;
• a second COF layer disposed on the first COF layer, wherein a thermal conductivity of the second COF layer is higher than the first COF layer;
• and
• a second conductive layer surrounded by the second COF layer;
• a passivation layer disposed on the interconnection layer;
• and
• conductive terminals disposed on the passivation layer and electrically connected to the interconnection layer.

A method of fabricating a semiconductor device, comprising:

• providing a substrate;
• forming an interconnection layer on the substrate, wherein forming the interconnection layer comprises:
• forming a first covalent organic framework (COF) layer on the substrate;
• patterning the first COF layer to form a first opening, and forming a first conductive layer in the first opening so that it is surrounded by the first COF layer;
• forming a second COF layer on the first COF layer, wherein a thermal conductivity of the second COF layer is higher than the first COF layer;
• and
• patterning the second COF layer to form a second opening, and forming a second conductive layer in the second opening so that it is surrounded by the second COF layer;
• forming a passivation layer on the interconnection layer;
• and
• forming conductive terminals on the passivation layer and electrically connected to the interconnection layer.