Package comprising a substrate with a bridge configured for a back side power distribution network

A device comprising:

• a package comprising:
• a substrate;
• a bridge located in the substrate, wherein the bridge comprises:
• a bridge substrate;
• at least one first bridge dielectric layer coupled to a first surface of the bridge substrate;
• at least one first bridge interconnect located in the at least one first bridge dielectric layer;
• at least one second bridge dielectric layer coupled to a second surface of the bridge substrate;
• at least one second bridge interconnect located in the at least one second bridge dielectric layer;
• and
• at least one bridge interconnect that extends through the at least one first bridge dielectric layer and the bridge substrate;
• a first integrated device coupled to the substrate;
• and
• a second integrated device coupled to the substrate.

A method for fabricating a package, comprising:

• providing a substrate;
• placing a bridge in the substrate, wherein the bridge comprises:
• a bridge substrate;
• at least one first bridge dielectric layer coupled to a first surface of the bridge substrate;
• at least one first bridge interconnect located in the at least one first bridge dielectric layer;
• at least one second bridge dielectric layer coupled to a second surface of the bridge substrate;
• at least one second bridge interconnect located in the at least one second bridge dielectric layer;
• and
• at least one bridge interconnect that extends through the at least one first bridge dielectric layer and the bridge substrate;
• coupling a first integrated device to the substrate;
• and
• coupling a second integrated device to the substrate.