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US 2023/0402375 A1Published application
Interconnect structure having different dimensions for connected circuit blocks in integrated circuit
AssigneeSamsung Electronics Co., Ltd.
InventorsEun Sung KIM, Hyoeun Park, Kang-ill Seo
Life of this patent
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Abstract
A interconnect structure for an integrated circuit may include: a metal line including a plurality of sections having different thicknesses along a 1st direction; and a plurality of vias respectively protruding from the plurality of sections of the metal line.
Claims22
An interconnect structure for an integrated circuit, the interconnect structure comprising:
- a metal line comprising a plurality of sections having different thicknesses along a 1st direction;
- and
- a plurality of vias respectively protruding from the sections of the metal line.
(canceled)
An interconnect structure for an integrated circuit, the interconnect structure comprising:
- a metal line comprising a plurality of sections extended in a 1st direction;
- and
- a plurality of vias respectively protruding from the plurality of sections, the vias having different protrusion heights in a 2nd direction perpendicular to the 1st direction, and different widths in at least one of the 1st and 2nd directions.
(canceled)
A method of manufacturing an integrated circuit comprising an interconnect structure, the method comprising:
- etching a metal structure to obtain a metal line comprising a plurality of sections, extended in a 1st direction, from which a plurality of vias respectively protrude;
- masking at least a 1st section of the sections with at least 1st via of the vias protruding therefrom using a masking material, and etching at least a 2nd section of the sections with at least a 2nd via of the vias protruding therefrom such that, after the etching, the 2nd section with the 2nd via protruding therefrom is exposed, and the 2nd section is thinner than the metal line and/or the 2nd via is taller and narrower than the 1st via;
- and
- removing the masking material to expose the 1st section with the 1st via protruding therefrom.
1 more element
Dependencies are inferred from the claim text.