Electronic package with heatsink and manufacturing method therefor

A method for manufacturing an electronic package, the method comprising the steps of:

• a) providing an electronic package comprising:
• a first substrate;
• an electronic component arranged on and/or formed in the first substrate;
• a thermally conductive second substrate comprising a first portion and a second portion integrally connected to the first portion, wherein at least the first portion among the first and second portion is fixedly attached to the electronic component;
• and
• a package material arranged to encapsulate the electronic component and to at least partially encapsulate the first and second substrate;
• and
• b) forming a recess in the package material extending up to a surface of the first portion, wherein the recess has a contour, viewed in a direction in which the recess extends towards the first portion, is formed to allow identification of an orientation of the electronic package viewed in the direction.