Semiconductor device

A semiconductor device comprising:

• a first die pad;
• a second die pad spaced apart from the first die pad in a first direction and having a potential different from a potential of the first die pad;
• a first semiconductor element mounted on the first die pad and constituting a first circuit together with the first die pad;
• a second semiconductor element mounted on the second die pad and constituting a second circuit together with the second die pad;
• an insulating element mounted on a specific die pad, relaying transmission and reception of a signal between the first circuit and the second circuit, and insulating the first circuit and the second circuit from each other, where one of the first die pad and the second die pad is referred to as the specific die pad and the other as a non-specific die pad,
• a first wire bonded to the insulating element and a specific semiconductor element, where one of the first semiconductor element and the second semiconductor element that is mounted on the non-specific die pad is referred to as the specific semiconductor element and the other mounted on the specific die pad is referred to as a non-specific semiconductor element;
• and
• a sealing resin covering the first die pad, the second die pad, the first semiconductor element, the second semiconductor element, and the insulating element, the sealing resin insulating the first die pad and the second die pad from each other,
• wherein the first wire bridges across a pad gap provided between the first die pad and the second die pad in the first direction,
• the first wire has a first upright section, a first inclined section, a first extended section, a first bent section, and a second bent section, the first upright section rising from the insulating element in a thickness direction of the first die pad, the first inclined section being inclined relative to the thickness direction and extending from the specific semiconductor element toward the insulating element, the first extended section being located between the first upright section and the first inclined section as viewed in the thickness direction, the first bent section being connected to the first upright section and the first extended section, the second bent section being connected to the first inclined section and the first extended section, and
• an inclination angle of the first extended section relative to a plane perpendicular to the thickness direction is smaller than an inclination angle of the first inclined section relative to the plane.