Lead frame and electronic component

A lead frame for an electronic component, the lead frame comprising:

• a die pad;
• a plurality of leads;
• and
• a frame member surrounding the die pad and the plurality of leads, wherein
• the frame member includes a first connection bar extending in a first direction and a second connection bar extending in a second direction,
• the die pad is connected to the second connection bar,
• the plurality of leads include a plurality of first leads connected to the first connection bar and a plurality of second leads connected to the second connection bar,
• the number of the plurality of second leads is smaller than the number of the plurality of first leads, and
• each of the plurality of second leads is connected to one corresponding first lead of the plurality of first leads.