Compartment Shielding With Metal Frame and Cap

A method of making a semiconductor device, comprising:

• providing a substrate;
• disposing a semiconductor die over the substrate;
• disposing a frame over the substrate around the semiconductor die, wherein the frame includes an opening and a flap formed at an edge of the opening;
• and
• disposing a lid over the frame.

A semiconductor device, comprising:

• a substrate;
• a first semiconductor die disposed over the substrate;
• a metal frame disposed over the substrate around the first semiconductor die, wherein the metal frame includes an opening and a flap formed at an edge of the opening;
• and
• a metal lid disposed over the metal frame, wherein a sidewall of the metal lid includes an elastic characteristic to latch onto the metal frame.

A semiconductor device, comprising:

• a substrate;
• a semiconductor die disposed over the substrate;
• a frame disposed over the substrate around the semiconductor die;
• and
• a lid disposed over the frame.