Method and apparatus for treating substrate

A substrate treating apparatus comprising:

• a high pressure chamber configured to form a treating space for performing a supercritical treating process therein;
• a substrate support unit configured to support a substrate at the treating space;
• a fluid supply unit configured to supply a treating fluid to the treating space;
• and
• an exhaust unit configured to exhaust an atmosphere of the treating space, and wherein the fluid supply unit comprises:
• a first and second injection line provided at a top surface of the high pressure chamber;
• and
• a cover plate positioned between the top surface of the high pressure chamber and the substrate support unit, blocking the treating fluid supplied from the first injection line from being directly sprayed in a direction to a treating surface of the substrate, and having a supply hole connected to the second injection line and configured to directly supply the treating fluid to the treating surface of the substrate.

A substrate treating apparatus comprising:

• a substrate support unit configured to support a substrate at a treating space of a chamber;
• a plate having a through hole formed therein and positioned opposite to a treating surface of the substrate;
• and
• a fluid supply unit for supplying a treating fluid to the treating space, and
• wherein the fluid supply unit comprises a first injection line for supplying the treating fluid to a top surface of the plate;
• and a second injection line for supplying the treating fluid to the through hole of the plate.