Methods for mounting an electronic package to a circuit board

A method for mounting an electronic package to a circuit board, the method comprising:

• providing an electronic package, the electronic package including a substrate having a first side and a second side, a first electronic module mounted to the first side of the substrate, a first mold structure extending over at least part of the first side of the substrate, and a group of through-mold connections that are electrically conductive and provided on the first side of the substrate, the first mold structure substantially encapsulating the group of through-mold connections, the group of through-mold connections exposed through the first mold structure;
• providing a circuit board configured to receive the electronic package;
• and
• mounting the electronic package to the circuit board by use of a group of intermediate solder portions such that each of intermediate solder portion the group of intermediate solder portions couples a corresponding through-mold connection of the group of through-mold connections to the circuit board, the through-mold connections formed of an alloy including tin and antimony, the alloy having a solidus temperature greater than a liquidus temperature of the intermediate solder portions.

A method for mounting an electronic package to a circuit board, the method comprising:

• providing an electronic package, the electronic package including a substrate having a first side and a second side, a first electronic module mounted to the first side of the substrate, a first mold structure extending over at least part of the first side of the substrate, and a group of through-mold connections that are electrically conductive and provided on the first side of the substrate, the first mold structure substantially encapsulating the group of through-mold connections, the group of through-mold connections exposed through the first mold structure;
• providing a circuit board;
• and
• mounting the electronic package to the circuit board by use of a group of intermediate solder portions such that each intermediate solder portion of the group of intermediate solder portions couples a corresponding through-mold connection of the group of through-mold connections to the circuit board, the through-mold connections formed of an alloy including tin and antimony, the alloy having a solidus temperature of at least 240 degrees Celsius.