Methods for manufacturing electronic packages and electronic assemblies

A method for manufacturing an electronic package, the method comprising:

• providing a substrate having a first side and a second side;
• arranging a group of through-mold connections that are electrically conductive on the first side of the substrate, the arranging including directly fusing each of the group of through-mold connections to a corresponding electrically conductive node provided on or embedded in the substrate;
• mounting a first electronic module to the first side of the substrate;
• applying a first mold structure to the first side of the substrate such that the first mold structure extends over at least part of the first side of the substrate to substantially encapsulate the group of through-mold connections;
• and
• removing a portion of the first mold structure to expose the group of through-mold connections, the group of through-mold connections are configured to be coupled to a circuit board by a corresponding group of intermediate solder portions, the through-mold connections formed of an alloy including tin and antimony, the alloy having a solidus temperature greater than a liquidus temperature of the intermediate solder portions.

A method of manufacturing an electronic assembly, the method comprising:

• encapsulating an electronic module and electrically conductive through-mold connections with a mold structure, the electronic module and the electrically conductive through-mold connections being positioned on a first side of a substrate;
• removing a portion of the mold structure to expose the electrically conductive through-mold connections;
• and
• electrically connecting the electrically conductive through-mold connections to a circuit board using solder connections, the electrically conductive through-mold connections having a melting point that is higher than a melting point the solder connections.