US 2023/0402265 A1 · PROCESS CHAMBER AND SEMICONDUCTOR PROCESS DEVICE

Abstract

The present disclosure provides a process chamber and a semiconductor process apparatus. The process chamber is applied in the semiconductor process apparatus and includes a chamber body, a base, and a chuck assembly. The reaction chamber is formed in the chamber body. The base is located in the reaction chamber. The chuck assembly is connected to the base and configured to carry a wafer. The base includes a base body and a plurality of cantilevers. The plurality of cantilevers are arranged evenly along the circumference of the base body. Each cantilever is connected to the inner wall of the chamber body and the outer wall of the base body. The chamber body, the base body, and the cantilever have an integral structure and are made of a material having the electrical conductivity and the thermal conductivity.

Claims18

Dependent claims

A process chamber applied to a semiconductor process apparatus comprising:

a chamber body including a reaction chamber, the base is located in the reaction chamber, and the chuck assembly is connected to the base and configured to carry a wafer;
a base located in the reaction chamber and including a base body and a plurality of cantilevers, the plurality of cantilevers being evenly arranged along a circumference of the base body at intervals, each cantilever of the plurality of cantilevers being connected to an inner wall of the chamber body and an outer wall of the base body and the chamber body, the base body, and the cantilevers being formed integrally and made of a material having electrical conductivity and thermal conductivity;
and
a chuck assembly connected to the base and configured to carry a wafer.

1 more element

A semiconductor process apparatus, comprising:

a process chamber including:
a chamber body including a reaction chamber, the base is located in the reaction chamber, and the chuck assembly is connected to the base and configured to carry a wafer;
a base located in the reaction chamber and including a base body and a plurality of cantilevers, the plurality of cantilevers being evenly arranged along a circumference of the base body at intervals, each cantilever of the plurality of cantilevers being connected to an inner wall of the chamber body and an outer wall of the base body, and the chamber body, the base body, and the cantilevers being formed integrally and made of a material having electrical conductivity and thermal conductivity;
and
a chuck assembly connected to the base and configured to carry a wafer;
a radio frequency (RF) assembly;
an air inlet assembly, the RF assembly and the air inlet assembly being arranged on a top of the chamber body;
and
an air outlet assembly arranged at a bottom of the chamber body.

6 more elements

Dependencies are inferred from the claim text.

Process chamber and semiconductor process device

Life of this patent

Process chamber and semiconductor process device

Life of this patent

Abstract

Claims18