Package structure and optical signal transmitter

A package structure, comprising:

• a circuit board;
• a package substrate, disposed on and electrically connected to the circuit board;
• a fine metal L/S RDL-substrate, disposed on and electrically connected to the package substrate;
• an electronic assembly, comprising an application specific integrated circuit assembly, an electronic integrated circuit assembly, and a photonic integrated circuit assembly respectively disposed on the fine metal L/S RDL-substrate and electrically connected to the package substrate by the fine metal L/S RDL-substrate, wherein the photonic integrated circuit assembly comprises an optical signal transmitter, and the optical signal transmitter comprises:
• a base, comprising a plurality of pads;
• a plurality of vertical cavity surface emitting laser sources, arranged in an array on the base;
• and
• a plurality of solder bumps, disposed between the base and the vertical cavity surface emitting laser sources, wherein the vertical cavity surface emitting laser sources are electrically connected to the pads of the base by the solder bumps;
• a heat dissipation assembly, disposed on the electronic assembly;
• and
• an optical fiber assembly, disposed on the package substrate and electrically connected to the package substrate and optically connected to the photonic integrated circuit assembly.