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US 2023/0400252 A1Published application
Substrate processing apparatus and method of processing a substrate using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsSANGJINE PARK, Ji Hwan PARK, KUNTACK LEE
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Abstract
A method of processing a substrate includes disposing a substrate in a drying chamber, and supplying a fluid into the drying chamber in which the substrate is disposed. The supplying of the fluid into the drying chamber includes supplying a gas into the drying chamber, and supplying a supercritical fluid into the drying chamber after the supplying of the gas is started.
Claims21
A method of processing a substrate, the method comprising:
- disposing a substrate in a drying chamber;
- and
- supplying a fluid into the drying chamber in which the substrate is disposed,
- wherein the supplying of the fluid into the drying chamber comprises:
- supplying a gas into the drying chamber;
- and
- supplying a supercritical fluid into the drying chamber after the supplying of the gas is started.
4 more elements
A method of processing a substrate, the method comprising:
- wet-processing a substrate;
- and
- dry-processing the substrate wet-processed,
- wherein the dry-processing of the substrate comprises:
- disposing the substrate in a drying chamber;
- supplying a gas into the drying chamber to increase a pressure in the drying chamber to a first pressure;
- and
- supplying a supercritical fluid into the drying chamber after the pressure in the drying chamber reaches the first pressure.
5 more elements
A substrate processing apparatus comprising:
- a drying chamber;
- a supercritical fluid supply unit configured to supply a supercritical fluid into the drying chamber;
- and
- a gas supply unit configured to supply a gas into the drying chamber,
- wherein the drying chamber comprises:
- a drying chamber housing providing a drying space;
- and
- a drying chuck in the drying chamber housing.
5 more elements
21-24. (canceled)
Dependencies are inferred from the claim text.