Photocurable adhesive or sealant composition

Abstract

The present invention is directed to a photo-curable adhesive or sealant composition comprising, based on the weight of the composition: from 1 to 10 wt. %, of a) at least one oxetane compound according to Formula (I) below: wherein: R1, R2, R3, R5 and R6 are independently selected from H and C1-C6 alkyl; R4 is —(CH2)mX; m is 0 or 1; X is C1-C6 alkyl, C1-C6 alkoxy, C1-C6 hydroxyalkyl, C6-C18 aryl, C6-C18 aryloxy, C7-C18 aralkyl, C7-C18 aralkoxy or is represented by the formula: each R7 is independently a C1-C12 alkylene group, C2-C12 alkenylene group, C6-C18 arylene, C7-C18 alkarylene, C7-C18 aralkylene or a poly(C1-C6alkyleneoxy) group; R8 is H, C1-C6 alkyl, C1-C6 hydroxyalkyl, C6-C18 aryl or C7-C18 aralkyl; and, n is an integer of from 1 to 3; from 5 to 20 wt. % of b) at least one epoxide compound, wherein part b) is characterized in that at least 50 wt. % of the total weight of epoxide compounds is constituted by b1) at one cycloaliphatic epoxide; from 0.1 to 5 wt. % of c) at least one ionic photoacid generator; from 0.1 to 5 wt. % of d) at least one free radical photoinitiator; and, from 50 to 90 wt. % of e) particulate filler.

Dependencies are inferred from the claim text.