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US 2023/0399511 A1Published application
Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHiroaki UMEHARA, Hirosuke SAITO
Life of this patent
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Abstract
A resin composition contains a polyphenylene ether compound having a carbon-carbon unsaturated double bond at the terminal, a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and an inorganic filler.
Claims17
A resin composition comprising:
- a polyphenylene ether compound having a carbon-carbon unsaturated double bond at a terminal;
- a maleimide compound (A) having an arylene structure bonded in meta-orientation in a molecule;
- and
- an inorganic filler.
1 more element
Dependencies are inferred from the claim text.