Back to results
US 2023/0398730 A1Published application
Systems and methods for reinforcing multi-layer structures
AssigneeDana Italia S.R.L.
InventorsMatteo DALLAPICCOLA, Fabrizio ZENDRI
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to methods and systems for 3D printing. In one example, a 3D multi-layer structure is printed with a cavity distributed over multiple layers of a first filamentary material and shaped as a double-headed rivet. Further, the cavity is filled with a second filamentary material in a vertical direction to form a filament-based rivet, the vertical direction perpendicular to the plane of the multiple layers.
Claims5
A multi-layer structure, comprising:
- stacked layers of a first filamentary material, the stacked layers arranged coplanar and stacked along a vertical axis;
- cavities formed within the stacked layers of the first filamentary material and filled with a second filamentary material, the cavities shaped as double-headed rivets and arranged in a three-dimensional pattern in the multi-layer structure;
- wherein each of the cavities extends across more than one layer of the stacked layers of the first filamentary material.
Dependencies are inferred from the claim text.