US 2023/0398659 A1 · Polishing Pad for Chemical Mechanical Polishing and Method

Abstract

Polishing pads having varying protrusions and methods of forming the same are disclosed. In an embodiment, a polishing pad includes a polishing pad substrate; a first protrusion on the polishing pad substrate, the first protrusion including a central region and a peripheral region surrounding the central region, and a first hardness of the central region being greater than a second hardness of the peripheral region; and a first groove adjacent a first side of the first protrusion.

Claims20

Dependent claims

A polishing pad comprising:

a polishing pad substrate;
a first protrusion on the polishing pad substrate, wherein the first protrusion comprises a central region and a peripheral region laterally surrounding the central region, and wherein a first hardness of the central region is different than a second hardness of the peripheral region;
and
a first groove adjacent a first side of the first protrusion.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

17/822,867Filed 29 Aug 2022

Priority

9 Jun 2022

Published

14 Dec 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

B24D 3/00
Physical features of abrasive bodies, or sheets
B24B 7/228
For grinding inorganic material, e.g. stone, ceramics, porcelain: for grinding thin, brittle parts, e.g. semiconductors, wafers
B24B 37/22
Lapping pads for working plane surfaces: characterised by a multi-layered structure
B24B 37/26
Lapping pads for working plane surfaces: characterised by the shape of the lapping pad surface, e.g. grooved

Polishing Pad for Chemical Mechanical Polishing and Method

Life of this patent

Polishing Pad for Chemical Mechanical Polishing and Method

Life of this patent

Abstract

Claims20