Polymer film and laminate

Abstract

An object of the present invention is to provide a polymer film having a more excellent adhesiveness to a metal layer. In addition, another object of the present invention is to provide a laminate having the polymer film. The polymer film of an embodiment of the present invention is a polymer film including a polymer and having a dielectric loss tangent of 0.005 or less under the conditions of a temperature of 23° C. and a frequency of 28 GHz, in which a relaxation peak disappearance temperature of a relaxation peak in a frequency dependence of the dielectric loss tangent of the polymer film is −80° C. or higher. In addition, the polymer film of the embodiment of the present invention is a polymer film including a polymer and having a dielectric loss tangent of 0.005 or less under the conditions of a temperature of 23° C. and a frequency of 28 GHz, in which an A value obtained by a predetermined measurement method is 1 to 60 eq/t.

Dependencies are inferred from the claim text.