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US 2023/0390893 A1Published application
Method, system, and apparatus for processing wafer
AssigneeMeere Company Inc.
InventorsIl Jun JUNG, Ki Ho KIM, Jung Yul HAN, Ki Heon LEE, Ji Hun PARK
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Abstract
A wafer processing method is provided. The method includes preparing a wafer having a notch portion at one side thereof, aligning the wafer by analyzing image information of the notch portion captured by a vision camera, and processing the notch portion using a notch wheel so that a certain region of the notch portion has a preset thickness.
Claims13
A wafer processing method comprising:
- preparing a wafer having a notch portion at one side thereof;
- aligning the wafer;
- and
- processing the notch portion using a notch wheel so that a certain region of the notch portion has a preset thickness.
1 more element
A wafer processing system comprising:
- a support table on which a wafer having a notch portion at one side thereof is seated;
- an alignment device acquiring image information of the notch portion using a vision camera imaging the notch portion of the wafer seated on the support table and aligning the wafer by analyzing acquired image information of the notch portion;
- and
- a notch processing device including a notch wheel processing the notch portion so that a certain region of the notch portion has a preset thickness and a spindle having one end at which the notch wheel is rotatably mounted.
1 more element
A wafer processing device comprising:
- a notch wheel processing a notch portion of a wafer so that a certain region of the notch portion has a preset thickness;
- and
- a spindle having one end at which the notch wheel is rotatably mounted.
Dependencies are inferred from the claim text.