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US 2023/0387880 A1Published application
Electronic structure and method of manufacturing the same
AssigneeWin Semiconductors Corp.
InventorsChia-Ta CHANG, Po-Wei TING
Life of this patent
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Abstract
An electronic structure is provided. The electronic structure includes a substrate, a plurality of conductors, a bump structure, and a protective layer. The conductors are disposed on the substrate. The bump structure is disposed on at least one of the conductors. The protective layer is disposed on the conductors. A region is exposed between the conductors. A method of manufacturing the electronic structure is also provided.
Claims20
An electronic structure, comprising:
- a substrate;
- a first conductor disposed on the substrate having a first top surface and a first side surface;
- a second conductor electrically connected to the first conductor and having a second top surface and a second side surface;
- an insulator covering the first top surface and the first side surface of the first conductor;
- a protective layer covering the second top surface of the second conductor and exposing the second side surface of the second conductor;
- and
- a bump structure disposed on the second conductor;
- wherein the protective layer comprises a metal material.
5 more elements
An electronic structure, comprising:
- a substrate;
- a plurality of conductors disposed on the substrate;
- a bump structure disposed on at least one of the plurality of conductors;
- and
- a protective layer disposed on the plurality of conductors and exposing a region between the plurality of conductors.
2 more elements
A method of manufacturing an electronic structure, comprising:
- forming a plurality of conductors on a substrate,
- forming a protective layer on an exposed portion of the plurality of conductors and exposing a region between the plurality of conductors;
- and
- reflowing a bump material to form a bump on one of the plurality of conductors.
1 more element
Dependencies are inferred from the claim text.