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US 2023/0363115 A1Published application
Heat dissipation module
AssigneeClevo Co.
InventorChi-Hsueh YANG
Life of this patent
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Abstract
A heat dissipation module is provided. The heat dissipation module includes a heat dissipating sheet and a heat conduction member. The heat dissipating sheet has a first surface and a second surface. The heat conduction member is disposed on the first surface of the heat dissipating sheet, and the second surface of the heat dissipating sheet is configured to be arranged adjacent to a periphery of a heating source. At least a part of a surface of the heat conduction member that is adjacent to the first surface has an uneven surface.
Claims17
A heat dissipation module, comprising:
- a heat dissipating sheet having a first surface and a second surface;
- and
- a heat conduction member disposed on the first surface of the heat dissipating sheet;
- wherein the second surface of the heat dissipating sheet is configured to be arranged adjacent to a periphery of a heat generating source;
- wherein at least a part of one surface of the heat conduction member that is adjacent to the first surface has an uneven surface.
2 more elements
Dependencies are inferred from the claim text.