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US 2023/0352867 A1Published application
Terminal plating material, terminal connection structure using terminal plating material, and service plug
AssigneeYazaki Corporation
InventorsHiroshi FUJITA, Hideki MIZUNO, Yasuo YAMAUCHI, Satoka OHNISHI
Life of this patent
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Abstract
A terminal plating material includes a metallic base that contains copper or a copper alloy, and a carbon composite silver plating layer that disposed on the metallic base and contains either silver or a silver alloy and carbon.
Claims8
A terminal plating material comprising:
- a metallic base that contains copper or a copper alloy;
- and
- a carbon composite silver plating layer that is disposed on the metallic base and contains either silver or a silver alloy and carbon.
Dependencies are inferred from the claim text.