Multistage micromechanical timepiece and method for making same

A method for manufacturing a timepiece according to includes the following successive steps:

• a. Providing a substrate of a semiconductor material, said substrate preferably comprising alignment markers on a first face, and
• b. Depositing, on a second face of the substrate, a sacrificial material layer of a determined height h and homogeneous over the entire area of the second face of the substrate;
• c. Structuring the sacrificial material layer by an etching process to form openings therein over its entire height h;
• d. Depositing a growth layer of a semiconductor material on the sacrificial material layer so as to fill the previously formed openings and completely cover it,
• e. Structuring the growth layer by an etching process to form a first functional subassembly including portions movable relative to each other and to the substrate by means of at least one deformable link;
• f. Structuring the semiconductor material substrate by an etching process to form a second functional subassembly including portions movable relative to each other and to the growth layer by means of at least a deformable link;
• g. Removing the sacrificial material layer between the substrate and the growth layer to form linking bridges between said subassemblies and release said timepiece.