High-frequency dielectric heating adhesive sheet
AssigneeLintec Corporation
InventorNaoki TAYA
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Abstract
A high-frequency dielectric heating adhesive sheet includes an adhesive layer that at least contains a thermoplastic resin and a dielectric material that generates heat upon application of a high-frequency electric field. The adhesive layer contains silane-modified polyolefin as the thermoplastic resin, and a melt flow rate (MFR) at 190° C. of the thermoplastic resin is in a range from 2 g/10 min to 50 g/10 min.
Claims9
A high-frequency dielectric heating adhesive sheet comprising an adhesive layer that at least comprises a thermoplastic resin (A) and a dielectric material that generates heat upon application of a high-frequency electric field, wherein
- the adhesive layer comprises silane-modified polyolefin as the thermoplastic resin (A), and
- a melt flow rate (MFR) at 190° C. of the thermoplastic resin (A) is in a range from 2 g/10 min to 50 g/10 min.
Dependencies are inferred from the claim text.