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US 2023/0287566 A1Published application
Method and apparatus for producing a gas curtain of purge gas in a slit valve tunnel
AssigneeSiltronic AG
InventorsPatrick MOOS, Marco FELDMANN
Life of this patent
Estimating the term…
Abstract
Contamination of semiconductor wafers during coating and other operations is mitigated by passing the wafer through a tunnel with a slit providing a gas curtain which impinges upon the wafer as the wafer is transported from one station to the next station in the processing apparatus.
Claims22
-7. (canceled)
An apparatus for treating a semiconductor wafer comprising:
- a tunnel having a first portion and a second portion opposite the first portion, the tunnel having an opening defining a transport path for transporting a semiconductor wafer from a first side to a second side of the tunnel or vice versa, the opening being between the first portion and a second portion and in communication with a channel via a slit, the channel extending from a first end to a second end of the first portion and the slit being laterally defined by a wall;
- and
- a cover configured to be removably fastened to the tunnel along the channel;
- wherein, during operation, a gas is directed through the channel forming a gas curtain from the first portion towards the second portion such that it impinges a surface of the semiconductor wafer that is transported along the transport path from the first side through the opening to the second side.
1 more element
Dependencies are inferred from the claim text.