Method for manufacturing joined body, joined body, and hot-melt adhesive sheet

2:

• The method according to claim 1, wherein when the melt viscosity of the hot-melt adhesive sheet is measured under the condition of 5° C./min, the hot-melt adhesive sheet has a ratio of a melt viscosity at 100° C. to a melt viscosity at 120° C. of 10 or higher.

3:

• The method according to claim 1, wherein a mass ratio of the crystalline polyamide resin and the crystalline polyester resin is from 10:90 to 90:10.

5:

• The method according to claim 1, wherein an average particle diameter of the electroconductive particles is 70% or more than a thickness of the hot-melt adhesive sheet.

6:

• The method according to claim 1, wherein each of the first electronic component and the second electronic component comprises a base material, and the base material of at least one of the first electronic component and the second electronic component is composed of polyvinyl chloride.

7:

• The method according to claim 1, wherein the thermocompression bonding temperature is from 110° C. to 130° C.

9:

• The joined body according to claim 8, wherein each of the first electronic component and the second electronic component comprises a base material, and the base material of at least one of the first electronic component and the second electronic component is composed of polyvinyl chloride.

11:

• The hot-melt adhesive sheet according to claim 10, wherein a mass ratio of the crystalline polyamide resin and the crystalline polyester resin is 10:90 to 90:10.

13:

• The hot-melt adhesive sheet according to claim 10, wherein an average particle diameter of the electroconductive particles is 70% or more than a thickness of the hot-melt adhesive sheet.