Composition and cured product thereof
AssigneeDenka Company Limited
InventorToru ARAI
Life of this patent
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AssigneeDenka Company Limited
InventorToru ARAI
Estimating the term…
A varnish having low viscosity and a cured product thereof having a high degree of cross-linking, exhibiting excellent low dielectric properties and mechanical properties at high temperature, and a low coefficient of linear thermal expansion are provided. A varnish comprising an olefin-aromatic vinyl compound-aromatic polyene copolymerized oligomer satisfying specific conditions, one or more selected from the following (a) to (c), and (d) a solvent: (a) a curing agent; (b) one or a plurality of resins selected from a hydrocarbon-based elastomer, a polyphenylene ether-based resin, an olefin-aromatic vinyl compound-aromatic polyene copolymer, and an aromatic polyene-based resin; and (c) a polar monomer; and a cured product of the varnish.
1-10. (canceled)
A varnish, comprising:
A molded product, comprising:
A cured product, comprising:
A method for manufacturing a varnish, the method comprising the steps of:
A cured product of a varinish, wherein the cured product has a storage elastic modulus of 2.5×106 Pa or more at 300° C., and wherein the cured product has a dielectric constant of 2.5 or less and 2.0 or more and a dielectric loss tangent of 0.003 or less and 0.0005 or more as measure at 23° C. and 10 GHz.
Dependencies are inferred from the claim text.