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AssigneeZhuhai ACCESS Semiconductor Co., Ltd.
InventorsXianming CHEN, Wenjian LIN, Gao HUANG, Lei FENG, Jindong FENG, Benxia HUANG, Zhijun ZHANG
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A package substrate and a manufacturing method thereof are disclosed. The method includes: providing an inner substrate; processing an adhesive photosensitive material on a surface of a first side of the inner substrate to obtain an adhesive first insulating dielectric layer; mounting a component on the first insulating dielectric layer; and processing a photosensitive packaging material on the first side of the inner substrate to obtain a second insulating dielectric layer, where the second insulating dielectric layer covers the component.
A method for manufacturing a package substrate, comprising:
A package substrate, comprising an inner substrate, a component and an insulating dielectric outer layer, wherein the insulating dielectric outer layer is obtained by processing a photosensitive material, the component and the insulating dielectric outer layer are both arranged on a first side of the inner substrate, and the component is located in the insulating dielectric outer layer.
Dependencies are inferred from the claim text.