Circuit module and large-scale circuit system
AssigneeMurata Manufacturing Co., Ltd.
InventorsOsamu MIKI, Tatsuya HOSOTANI
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AssigneeMurata Manufacturing Co., Ltd.
InventorsOsamu MIKI, Tatsuya HOSOTANI
Estimating the term…
A circuit module includes a circuit module substrate having an area smaller than a large-scale circuit board, an electronic circuit component mounted on the circuit module substrate, a connection pin provided to the circuit module substrate, and a circuit-module-substrate-side fitting structure part provided to the circuit module substrate. A pin receptacle and the connection pin are electrically connected to each other. A non-conductive thermal adhesive layer is formed between a surface of the circuit module substrate and a surface of a base material of the large-scale circuit board facing to each other, the non-conductive thermal adhesive layer electrically insulating and thermally joining the surfaces by a non-conductive thermally conductive material.
A circuit module comprising:
Dependencies are inferred from the claim text.