Multilayer circuit board having signal and power isolation circuit

A multilayer circuit board having a signal and power isolation circuit, comprising:

• a microstrip line on a component mounting surface;
• a mounting pad on the microstrip line and having a wider width than a line width of the microstrip line;
• at least one chip inductor mounted on the component mounting surface and electrically connected between the mounting pad and a power supply;
• an inductor characteristic compensation portion having a predetermined area in a mounting-surface-below portion of an inner-layer ground disposed immediately below the component mounting surface, the mounting-surface-below portion of the inner-layer ground being situated immediately below the chip inductor;
• and
• a signal transmission characteristic compensation portion having a predetermined area in a portion of the inner-layer ground, the portion of the inner-layer ground being situated immediately below the mounting pad, at a position separated from the inductor characteristic compensation portion by a predetermined distance such that the signal transmission characteristic compensation portion is electrically isolated from the inductor characteristic compensation portion.