Radio frequency module and communication device

A radio frequency module, comprising:

• a module substrate;
• an electronic component on a main surface of the module substrate;
• a resin covering at least part of the main surface and at least part of a side surface of the electronic component;
• and
• a first metal layer that is on a surface of the resin and is at a ground potential,
• wherein the electronic component comprises:
• a first surface in contact with the first metal layer,
• a second surface facing the main surface,
• a circuit portion at a position closer to the second surface than to the first surface, and
• a second metal layer between the first metal layer and the circuit portion,
• wherein the first metal layer is made of copper or an alloy containing copper, or is a multilayer body containing copper, and
• wherein the second metal layer is made of titanium, tantalum, cobalt, tungsten, or an alloy containing at least one of titanium, tantalum, cobalt, and tungsten.