Back to results
US 2023/0275337 A1Published application
Electronic package and fabrication method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChung-Yu Ke, Chia-Chu Lai, Liang-Pin Chen
Life of this patent
Estimating the term…
Abstract
An electronic package is provided and includes a first carrier structure having a plurality of antenna feed lines, and an antenna module disposed on the first carrier structure. The antenna module includes a substrate body having a plurality of recesses with different depths. Further, antenna layers are formed in the plurality of recesses and electromagnetically coupled to the antenna feed lines so as to improve the overall radiation efficiency of the antenna assembly.
Claims20
An electronic package, comprising:
- a first carrier structure;
- and
- an antenna module disposed on the first carrier structure to form an air gap between the antenna module and the first carrier structure, and the antenna module comprising a substrate body having a first surface and a second surface opposing the first surface, the substrate body being disposed on the first carrier structure via the first surface thereof, wherein the first surface is formed with a plurality of first antenna layers, and the second surface is formed with a plurality of second antenna layers electromagnetically coupled to the first antenna layers, and distances between the first antenna layers and the second antenna layers are different.
A method for fabricating an electronic package, comprising:
- providing a substrate body having a first surface and a second surface opposing the first surface, wherein the first surface has a plurality of first antenna layers thereon, the second surface has a plurality of second antenna layers electromagnetically coupled to the first antenna layers thereon, and distances between the first antenna layers and the second antenna layers are different;
- and
- disposing the substrate body on a first carrier structure via the first surface thereof to form an air gap between the antenna module and the first carrier structure.
Dependencies are inferred from the claim text.