US 2023/0275162 A1 · ASSEMBLY FOR A SEMICONDUCTOR PHOTONIC COMPONENT

Abstract

The invention relates to an assembly (10) for a semiconductor photonic component (31, 32), wherein the semiconductor photonic component (31, 32) is accommodated in an assembly housing (11) being shielded from the environment. Furthermore, the invention relates to an assembly housing (11) for use with such assembly for a semiconductor photonic component (31, 32). Accordingly, the assembly (10) at least comprising a substrate (30); at least one semiconductor photonic component (31, 32) mounted to the substrate (30), said at least one semiconductor photonic component (31, 32) including a photonic active surface element (31A, 32A); an assembly housing (11) for shielding the substrate (30) and the at least one semiconductor photonic component (31, 32) from the environment; the assembly housing (11) comprises a housing wall part (20, 20) provided with at least one photonic window element (21) facing the photonic active surface element (31A, 32A) of the at least one semiconductor photonic component (31), said at least one photonic window element (21) forming a monolithic part with the housing wall part (20, 20′) and having a transmissivity being larger than the transmissivity of the housing wall part (20, 20′).

Claims15

Dependent claims

An assembly for a semiconductor photonic component, the assembly at least comprising:

a substrate;
at least one semiconductor photonic component mounted to the substrate, said at least one semiconductor photonic component including a photonic active surface element;
an assembly housing for shielding the substrate and the at least one semiconductor photonic component from the environment;
the assembly housing comprises a housing wall part having an exterior surface and being provided with at least one photonic window element facing the photonic active surface element of the at least one semiconductor photonic component, said at least one photonic window element being a bottom wall of a recess in said exterior surface and forming a monolithic part with the housing wall part;
wherein the at least one photonic window element has a thickness which is smaller than the thickness of the housing wall part for having a transmissivity being larger than the transmissivity of the housing wall part, and
wherein the housing wall part contains a light absorbing dope and/or light blocking dope.

3 more elements

Dependencies are inferred from the claim text.

Assembly for a semiconductor photonic component

Life of this patent

Assembly for a semiconductor photonic component

Life of this patent

Abstract

Claims15