Semiconductor module, method for manufacturing the same, and power conversion device

A method for manufacturing a semiconductor module, the method comprising:

• arranging a semiconductor element on at least one of a plurality of frame patterns;
• arranging the plurality of frame patterns on a first surface of a fin base with an insulating sheet interposed therebetween, the insulating sheet being arranged on the first surface;
• and
• swaging a plurality of fins on a second surface such that the plurality of fins are spaced apart from each other in a first direction, the second surface being a surface opposite to the first surface, wherein
• the second surface is provided with a plurality of rising wall portions and a plurality of swaging portions, the plurality of rising wall portions extending along a second direction that intersects with the first direction and being spaced apart from each other in the first direction, each of the plurality of swaging portions extending along the second direction between adjacent two of the plurality of rising wall portions,
• an upper surface of each of the plurality of swaging portions is provided with a groove extending along the second direction,
• the swaging a plurality of fins is performed by inserting a tip of a swaging blade into the groove and expanding a width of the groove along the first direction,-
• the tip includes a first portion having a width in the first direction larger than the width of the groove, and a second portion having a width in the first direction smaller than the width of the groove,
• the first direction is along a longitudinal direction of the fin base,
• the first surface includes a first end and a second end in the first direction, the second end being an opposite to the first end,
• the plurality of frame patterns include a first frame pattern and a second frame pattern extending along the first direction and being spaced apart from each other in the second direction on a central portion of the first surface,
• both ends of each of the first frame pattern and the second frame pattern are located outside a first fin of the plurality of fins located closest to the first end and a second fin of the plurality of fins located closest to the second end, and
• the spaced-apart portion is arranged at a position that overlaps with a space between the first frame pattern and the second frame pattern, when viewed from a direction orthogonal to the first surface.