Back to results
US 2023/0275031 A1Published application
Method of Bonding Active Dies and Dummy Dies and Structures Thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Chia Hu, Sung-Feng Yeh, Ming-Fa Chen
Life of this patent
Estimating the term…
Abstract
A method includes bonding a first plurality of active dies to a second plurality of active dies in a wafer. The second plurality of active dies are in an inner region of the wafer. A first plurality of dummy dies are bonded to a second plurality of dummy dies in the wafer. The second plurality of dummy dies are in a peripheral region of the wafer, and the peripheral region encircles the inner region.
Claims20
A method comprising:
- bonding a first plurality of active dies to a second plurality of active dies in a wafer, wherein the second plurality of active dies are in an inner region of the wafer;
- and
- bonding a first plurality of dummy dies to a second plurality of dummy dies in the wafer, wherein the second plurality of dummy dies are in a peripheral region of the wafer, and wherein the peripheral region encircles the inner region.
A method comprising:
- forming a wafer having a round top-view shape, the wafer comprising:
- a first plurality of active dies, wherein the first plurality of active dies are in an inner region of the wafer;
- a first plurality of dummy dies arranged aligning a ring encircling the inner region;
- bonding a second plurality of active dies to the first plurality of active dies, wherein in the bonding the second plurality of active dies, first reference points of the first plurality of active dies are recorded, and wherein a distance between two neighboring ones of the first plurality of active dies is recorded;
- stepping away from one of the first reference points by the distance to reach a second reference point;
- and
- bonding a second plurality of dummy dies to the first plurality of dummy dies, wherein the bonding the second plurality of dummy dies comprises:
- offsetting from the second reference point to determine a first position;
- and
- bonding a first one of the second plurality of dummy dies to the first position.
7 more elements
A method comprising:
- forming a wafer comprising a first plurality of active dies and a first plurality of dummy dies;
- forming a plurality of alignment marks on the wafer;
- bonding a second plurality of active dies to the first plurality of active dies, with the plurality of alignment marks being used for alignment;
- determining positions of the first plurality of dummy dies in the wafer based on positions of the plurality of active dies in the wafer;
- and
- bonding a second plurality of dummy dies to the first plurality of dummy dies, wherein the second plurality of dummy dies are bonded to the positions.
3 more elements
Dependencies are inferred from the claim text.