Machine learning & integrated metrology for run-to-run optimization of chip-to-wafer alignment accuracy

An apparatus in an integrated bonding system for optimizing bonding alignment between a die and a substrate, comprising:

• a processor;
• and
• a memory coupled to the processor, the memory having stored therein at least one of programs or instructions executable by the processor to configure the apparatus to:
• cause a bonder of the integrated bonding system to bond a first die to a first substrate using preset alignment settings;
• cause a transfer robot of the integrated bonding system to transfer the bonded die-substrate combination to an on-board inspection tool of the integrated bonding system;
• cause the on-board inspection tool to inspect an alignment of the bond between the die and the substrate of the bonded die-substrate combination to determine a misalignment measure representing a misalignment of the bond between the die and the substrate of the bonded die-substrate combination;
• determine from the misalignment measurement, using a machine learning process, a correction measurement to be communicated to the bonder;
• and
• cause the bonder to bond a different die to a different substrate using the determined machine-learning based correction measurement.

An integrated bonding system for optimizing bonding alignment between a die and a substrate, comprising:

• a bonder bonding a first die to a first substrate using preset alignment settings;
• a transfer robot transferring the bonded die-substrate combination to an on-board inspection tool of the integrated bonding system;
• and
• an on-board inspection tool inspecting an alignment of the bond between the die and the substrate of the bonded die-substrate combination to determine a misalignment measure representing a misalignment of the bond between the die and the substrate of the bonded die-substrate combination and determining from the misalignment measurement, using a machine learning process, a correction measurement to be communicated to the bonder;
• wherein the bonder bonds a different die to a different substrate using the determined machine-learning based correction measurement.