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US 2023/0273654 A1Published application
Dual in-line memory module cover
AssigneeIntel Corporation
InventorsXiang LI, George VERGIS, Phil GENG
Life of this patent
Estimating the term…
Abstract
A standalone top cover retention mechanism can attach to the top of an array of tall (e.g., 2U) DIMMs to provide structural support. In one example, the DIMM cover is attached to two or more DIMMs without attaching to the chassis. The DIMM cover can mitigate shock and vibration related failures at the DIMM level without significant interference with platform thermal mechanical solutions.
Claims20
An apparatus comprising:
- a standalone rigid body to at least partially cover a plurality of dual inline memory modules (DIMMs);
- a plurality of grooves in a bottom of the standalone rigid body, each of the plurality of grooves to receive a top edge of one of the plurality of DIMMs;
- and
- one or more fasteners to secure the standalone rigid body over the plurality of DIMMs.
1 more element
A kit comprising:
- a plurality of dual inline memory modules (DIMMs);
- and
- a standalone DIMM cover including:
- a rigid body having a length to at least partially cover two or more DIMMs;
- a plurality of grooves in a bottom of the rigid body to receive top edges of the two or more DIMMs;
- and
- one or more fasteners to secure the rigid body over the two or more DIMMs.
4 more elements
A system comprising:
- a motherboard including a plurality of dual inline memory module (DIMM) slots;
- and
- a standalone DIMM cover including:
- a rigid body having a length to at least partially cover two or more DIMMs;
- a plurality of grooves in a bottom of the rigid body to receive top edges of the two or more DIMMs;
- and
- one or more fasteners to secure the rigid body over the two or more DIMMs.
4 more elements
Dependencies are inferred from the claim text.