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US 2023/0273518 A1Published application
Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
AssigneeShowa Denko Materials Co., Ltd.
InventorsTetsuya KATO, Akiko TAKEDA, Yutaka KAWAKAMI
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Abstract
An aspect of the present disclosure relates to a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, in which the binder polymer includes a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group, and a weight molecular weight of the binder polymer is 7500 to 23000.
Claims17
A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound, and a photopolymerization initiator,
- wherein the binder polymer includes a structural unit derived from a (meth)acrylate compound having a dicyclopentanyl group, and a weight average molecular weight of the binder polymer is 7500 to 23000.
Dependencies are inferred from the claim text.