Test board and method for testing semiconductor device

A test board comprising:

• a substrate;
• a socket mounted on the substrate and including a plurality of connector pins to be connected to a plurality of terminals of a semiconductor device when the semiconductor device is mounted in the socket;
• a plurality of external terminals through each of which a voltage or a signal is supplied to one of the plurality of connector pins;
• a plurality of first current paths, each of which is electrically connectable between one of the plurality of connector pins and one of the plurality of external terminals, and includes a first circuit element;
• a plurality of second current paths, each of which is electrically connectable between one of the plurality of connector pins and one of the plurality of external terminals, and includes no circuit element or a second circuit element different from the first circuit element;
• and
• a plurality of first connection mechanisms each capable of electrically connecting one of the plurality of connector pins to one of the plurality of external terminals via either one of the plurality of first current paths or one of the plurality of second current paths.

A method testing a semiconductor device using a test board including

• a substrate,
• a socket mounted on the substrate, and including a first connector pin,
• a plurality of external terminals through which a voltage or a signal is supplied to the first connector pin,
• a first current path that is electrically connectable between the first connector pin and one of the plurality of external terminals, and includes a first circuit element, and
• a second current path that is electrically connectable between the first connector pin and one of the plurality of external terminals, and includes no circuit element or a second circuit element different from the first circuit element, the method comprising:
• electrically connecting the first connector pin to one of the plurality of external terminals via one of the first current path and the second current path;
• mounting the semiconductor device in the socket of the test board so that the first connector pin is connected to a first terminal of the semiconductor device;
• setting the test board in a test apparatus;
• executing the test;
• detaching the test board from the test apparatus;
• detaching the semiconductor device from the test board;
• and
• measuring the semiconductor device by a tester.