Packaged pressure sensor device and corresponding method for detecting the presence of foreign material
AssigneeSTMicroelectronics S.r.l.
InventorsDomenico GIUSTI, Enri DUQI
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AssigneeSTMicroelectronics S.r.l.
InventorsDomenico GIUSTI, Enri DUQI
Estimating the term…
A pressure sensor device has: a pressure detection structure provided in a first die of semiconductor material; a package, configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure and a body structure, arranged on the base structure, with an access opening in contact with an external environment and internally defining a housing cavity, in which the first die is arranged covered with a coating material. A piezoelectric transduction structure, of a ultrasonic type, is accommodated in the housing cavity, in order to allow detection of foreign material above the coating material and within the package. In particular, the piezoelectric transduction structure is integrated in the first die, which comprises a first portion, wherein the pressure detection structure is integrated, and a second portion, separate and distinct from the first portion, wherein the piezoelectric transduction structure is integrated.
A device, comprising:
A method, comprising:
A device, comprising:
Dependencies are inferred from the claim text.