Phenol resin, epoxy resin, methods for producing these, epoxy resin composition and cured product thereof

Abstract

To provide an epoxy resin composition that exhibits excellent low dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, a phenol resin and an epoxy resin for providing the composition, and a method for producing such a resin. A phenol resin containing a dicyclopentenyl group and represented by the following general formula (1): wherein each R1 independently represents a hydrocarbon group having 1 to 8 carbon atoms; each R2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; i is an integer of 0 to 2; and n represents the number of repetitions and an average value thereof is a number of 10 to 10.

Dependencies are inferred from the claim text.