Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, comprising:

• (a) preparing a test apparatus provided with following (a1), (a2) and (a3):
• (a1) a test board having a plurality of terminals,
• (a2) a unit having a first surface and a second surface opposite the first surface, the unit being arranged such that the second surface faces the test board, and
• (a3) a plurality of probe pins each including a first tip portion and a second tip portion that are located on opposite side to each other and that have the same shape as each other, and each of the plurality of probe pins being housed in the unit such that the first tip portion protrudes from the first surface and the second tip portion protrudes from the second surface;
• (b) preparing a first semiconductor package having a plurality of first external terminals;
• (c) after the (a) and the (b), bringing the plurality of first external terminals of the first semiconductor package into contact with the first tip portion of the plurality of probe pins, respectively, and bringing the second tip portion of the plurality of probe pins into contact with the plurality of terminals of the test board, respectively, thereby performing an electrical test of the first semiconductor package;
• (d) after the (c), in the test apparatus, removing the unit, and rearranging the unit such that the first surface faces the test board;
• (e) preparing a second semiconductor package having a plurality of second external terminals;
• and
• (f) after the (d) and the (e), bringing the plurality of second external terminals of the second semiconductor package into contact with the second tip portion of the plurality of probe pins, respectively, and bringing the first tip portion of the plurality of probe pins into contact with the plurality of terminals of the test board, respectively, thereby performing an electrical test of the second semiconductor package.