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US 2023/0265288 A1Published application
Heat resistance resin composition and injection molded body thereof
AssigneeDenka Company Limited
InventorSoichiro NAKANISHI
Life of this patent
Estimating the term…
Abstract
A heat resistant resin composition which does not cause stringing when performing fusion-bonding using heated plates. A heat resistant resin composition, including: a maleimide-based copolymer; and at least one resin selected from the group including: ABS resin, ASA resin, AES resin, and SAN resin; wherein: the heat resistant resin composition has a ratio G′/G″ of storage modulus (G′) to loss modulus (G″) measured in accordance with JIS K 7244-10 under conditions of 240° C. at an angular velocity of 0.63 rad/s is 0.30 or more and 1.00 or less.
Claims7
A heat resistant resin composition, comprising:
- a maleimide-based copolymer;
- and
- at least one resin selected from the group consisting of:
- ABS resin, ASA resin, AES resin, and SAN resin;
- wherein:
- the heat resistant resin composition has a ratio G′/G″ of storage modulus (G′) to loss modulus (G″) measured in accordance with JIS K 7244-10 under conditions of 240° C. at an angular velocity of 0.63 rad/s is 0.30 or more and 1.00 or less.
3 more elements
Dependencies are inferred from the claim text.