Non-thermoplastic polyimide film, multi-layered polyimide film and metal-clad laminate

A non-thermoplastic polyimide film comprising non-thermoplastic polyimide,

• wherein the non-thermoplastic polyimide has a 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue and a 4,4′-oxydiphthalic anhydride residue as tetracarboxylic dianhydride residues, and a p-phenylenediamine residue and a 1,3-bis(4-aminophenoxy)benzene residue as diamine residues, and
• where a content ratio of the 3,3′,4,4′-biphenyltetracarboxylic dianhydride residue to all tetracarboxylic dianhydride residues forming the non-thermoplastic polyimide is A1 mol %, a content ratio of the 4,4′-oxydiphthalic anhydride residue to all tetracarboxylic dianhydride residues forming the non-thermoplastic polyimide is A2 mol %, a content ratio of the p-phenylenediamine residue to all diamine residues forming the non-thermoplastic polyimide is B1 mol %, and a content ratio of the 1,3-bis(4-aminophenoxy)benzene residue to all diamine residues forming the non-thermoplastic polyimide is B2 mol %, relationships of A1+A2≥80, B1+B2≥80 and (A1+B1)/(A2+B2)≤3.50 are satisfied.