Back to results
US 2023/0265246 A1Published application
Film, wiring board, and method for manufacturing wiring board
AssigneeFUJIFILM Corporation
InventorsShohei YAMAZAKI, Yasuyuki SASADA
Life of this patent
Estimating the term…
Abstract
Provided are a film which includes at least a first resin layer containing aromatic polyester amide, and a second resin layer disposed on the first resin layer, and an elastic modulus of the second resin layer at 160° C. is less than 1.0 GPa.
Claims10
A film comprising:
- a first resin layer comprising an aromatic polyester amide;
- and
- a second resin layer disposed on the first resin layer,
- wherein an elastic modulus of the second resin layer at 160° C. is less than 1.0 GPa.
1 more element
A wiring board comprising:
- a substrate;
- a wiring pattern comprising wires and disposed on at least one surface of the substrate;
- a second resin layer disposed on the wiring pattern so as to cover spaces between the wires and on the wires;
- and
- a first resin layer disposed on the second resin layer,
- wherein the first resin layer comprises an aromatic polyester amide, and
- an elastic modulus of the second resin layer at 160° C. is less than 1.0 GPa.
4 more elements
A method for manufacturing a wiring board, the method comprising:
- superimposing, on wires of a wiring pattern disposed on a substrate, a resin substrate comprising an aromatic polyester amide;
- heating the substrate with the wiring pattern and the resin substrate in a superimposed state to obtain a wiring board,
- wherein a region from a surface on a side on which the substrate with the wiring pattern is superimposed to a thickness position corresponding to a thickness of the wiring pattern in the resin substrate has an elastic modulus less than 1.0 GPa at a heating temperature at a time of the heating in the superimposed state.
Dependencies are inferred from the claim text.