Conveyance apparatus, substrate processing apparatus, conveyance method, and article manufacturing method

A conveyance method comprising:

• acquiring a state of a peripheral portion of an adhesion substrate including a pressing member and a substrate adhering to the pressing member with a material interposed in between;
• adjusting a position of the adhesion substrate based on a result of the acquiring;
• and
• conveying the adjusted adhesion substrate.

A substrate processing apparatus configured to bring a pressing member and a material on a substrate into contact with each other to form a cured film of the material on the substrate, the substrate processing apparatus comprising:

• an acquisition unit configured to acquire a state of a peripheral portion of an adhesion substrate including the pressing member and the substrate adhering to the pressing member with the material interposed in between;
• a position adjusting unit configured to adjust a position of the adhesion substrate based on a result acquired by the acquisition unit;
• and
• a conveyance unit configured to convey the adhesion substrate adjusted by the position adjusting unit.